Diamond Systems – New Rugged Embedded Products
Diamond Systems is expanding its portfolio of rugged embedded
computing solutions with new Intel® and NVIDIA® platforms,
high-density Ethernet switches, and mission-ready systems designed for
harsh defense and industrial applications. Below is a snapshot you can
share with your engineering teams and program managers.
Rugged Intel® SBCs – Jasper & Zeta/Athena
JASPER COM-based SBC – 3.5″ rugged SBC built around
COM Express Type 6:
- 11th & 13th Gen Intel® Core i7 and Xeon® options with PassMark
scores up to ~20,000. - Rich I/O: dual GigE, up to 4x RS-232/422/485, USB 3.0/2.0, dual
HDMI, LVDS. - Rugged design: conduction cooling, thicker PCB, latching
connectors, -40°C to +85°C. - Optional integrated data acquisition: A/D, D/A, GPIO with
autocalibration and Universal Driver.
Zeta / Athena SBCs – COM Express Type 10, upgrading
from Apollo Lake to new Amston Lake Atom CPUs:
- Atom x7433RE / x7835RE with PassMark up to ~6,500.
- Up to 16GB RAM and 256GB eMMC.
- Expected availability: Zeta – Dec 2025, Athena – Jan 2026.
NVIDIA Jetson AGX Thor Carrier – SEGER
SEGER is Diamond’s new carrier board for the NVIDIA®
Jetson AGX Thor module:
- 14-core Arm Neoverse CPU and Blackwell GPU with 5th-gen Tensor
Cores. - High-speed connectivity: dual 5G Ethernet, 10G Ethernet, and
multiple M.2 sockets (NVMe, Wi-Fi/BT, LTE/5G). - Display, camera (MIPI CSI-2 / GMSL), CAN, and extensive
GPIO/control I/O. - 24–60V DC input, up to 260W total power budget with dual-fan
thermal solution. - Target availability: March 2026.
High-Density Ethernet Switches – Epsilon & TSN
EPSM-10GX12 / EPS-25000 – 2.5G / 10G modular switch
family:
- Up to 60× 2.5G ports and 17× 10G ports with maximum 200Gbps
switching bandwidth. - Layer 3 routing/switching software (Istax) built in.
- Module + carrier + daughterboard options for scalable port counts.
- Early samples Dec 2025–Jan 2026; production Feb–Mar 2026.
EPSM-8G2F / EPSM-12G2F (Epsilon low-cost):
- 8 or 12× 1G copper ports + 2× 2.5G ports (copper or fiber via
PHY). - Built-in 2.5G PHYs, -40°C to +85°C operating temperature.
- New carrier options with either SFP or copper 2.5G ports.
EPS-9600 TSN Switch Family:
- 8× 1G copper + 2× 10G SFP+ with expansion up to 28 ports / 88Gbps
bandwidth. - Time-Sensitive Networking (TSN) with IEEE-1588 and advanced timing
features. - Heat sink and heat spreader options, -40°C to +85°C, rugged
connectors.
Rugged Systems – Geode, SabreCom & SabreNet
Diamond’s system offerings combine their SBCs and switches in
environmentally rugged enclosures:
- GEODE-JSP – Jasper-based rugged computer, IP67,
-40°C to +85°C, 9–60V DC input with MIL-STD-461/704/1275 power
options.<